Researchers from Purdue University, University of California and the University of Kentucky have constructed a new perovskite interlayer that reportedly exhibits both superior thermal and moisture stability in ambient conditions.
“Enhancing the stability and lifetime of perovskite devices is necessary in order to realize the goal of commercialization for perovskite photovoltaics,” said Jiaonan Sun. “Today, the stability of commonly used hole transporting layers (HTL) is still a bottleneck for achieving the required lifetime". Poly(triaryl amine) (PTAA) is a promising polymeric hole transporting material used in PSC applications, however, it’s hydrophobicity causes problematic interfacial contact with perovskite, limiting the device’s performance. Led by Dr. Letian Dou, the researchers successfully constructed a uniform two-dimensional (2D) perovskite interlayer with conjugated ligands, between three-dimensional (3D) perovskites and PTAA to improve the power conversion efficiency and the interfacial adhesion of the devices. These increased-ion migration, energy barrier conformal, 2D coated unencapsulated devices with new ligands provide greater thermal and moisture stability in different environments.