Researchers from China's Dongguan University of Technology and Xi'an Jiaotong University have developed a spontaneous cooling strategy with a hot-pressing technique that enables the production of high-purity, wafer-scale, pinhole-free perovskite wafers with a reflective surface.
This method can, according to the team, be extended to a variety of perovskite wafers, including organic-inorganic, 2D, and lead-free perovskites. The size of the wafer (with diameters of 10, 15, and 20 mm) can be tailored by changing the mold.
In their work, the team explained the mechanism of spontaneous cooling for improving the quality of perovskite wafers.
The team reports that the high-quality lead-free Cs3Cu2I5 perovskite wafers demonstrated excellent X-ray detection performances with a high sensitivity of 3433.6 µC Gyair-1 cm-2 and a low detection limit of 33.17 nGyair s-1. Moreover, the Cs3Cu2I5 wafers exhibited outstanding environmental and operational stability even without encapsulation.
These results present a spontaneous cooling strategy to achieve wafer-scale, high-quality perovskites with mirror-like surfaces for X-ray detection, paving the way for integrating perovskites into electronic and optoelectronic devices and promoting the practical application of perovskite X-ray detectors.
